US Patent Issued to SEOUL VIOSYS on Nov. 3 for "Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same" (South Korean Inventor)

Posted On: 2026-11-03

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,836, issued on Nov. 3, was assigned to SEOUL VIOSYS Co. LTD. (Ansan-si, South Korea). "Light emitting device having cantilever electrode, LE... Read More

US Patent Issued to FASFORD TECHNOLOGY on Nov. 3 for "Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,837, issued on Nov. 3, was assigned to FASFORD TECHNOLOGY Co. LTD. (Minami-Alps, Japan). "Dipping apparatus, die bonding apparatus, and manu... Read More

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 3 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,838, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for p... Read More

US Patent Issued to CANON MACHINERY on Nov. 3 for "Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" (Japanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,840, issued on Nov. 3, was assigned to CANON MACHINERY INC. (Shiga, Japan). "Position alignment device, position alignment method, bonding d... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a blocking layer on a solder ball" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,841, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having a blocking layer ... Read More

US Patent Issued to BEIJING YOUZHUJU NETWORK TECHNOLOGY on Nov. 3 for "Chip and method for forming the same, and package structure" (Chinese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,842, issued on Nov. 3, was assigned to BEIJING YOUZHUJU NETWORK TECHNOLOGY Co. LTD. (Beijing). "Chip and method for forming the same, and pa... Read More

US Patent Issued to DENSO on Nov. 3 for "Semiconductor device" (Japanese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,843, issued on Nov. 3, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device" was invented by Taro Igoshi (Kariya-city, Ja... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Method of fabricating semiconductor device having dummy micro bumps between stacking dies" (Taiwanese Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,844, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of fabricating semiconduct... Read More

US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on Nov. 3 for "Manufacturing method for a die including forming a copper layer using electroless plating with zinc displacement reaction" (Chinese Inventor)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,845, issued on Nov. 3, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Manufacturing method for a die includ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Release film and method of manufacturing semiconductor package using the same" (South Korean Inventors)

Posted On: 2026-11-03

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ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,846, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Release film and method of manufacturing semic... Read More

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US Patent Issued to SEOUL VIOSYS on Nov. 3 for "Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same" (South Korean Inventor)

US Patent Issued to FASFORD TECHNOLOGY on Nov. 3 for "Dipping apparatus, die bonding apparatus, and manufacturing method for semiconductor device" (Japanese Inventors)

US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 3 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

US Patent Issued to CANON MACHINERY on Nov. 3 for "Position alignment device, position alignment method, bonding device, bonding method, and method for manufacturing semiconductor device" (Japanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor package having a blocking layer on a solder ball" (South Korean Inventors)

US Patent Issued to BEIJING YOUZHUJU NETWORK TECHNOLOGY on Nov. 3 for "Chip and method for forming the same, and package structure" (Chinese Inventors)

US Patent Issued to DENSO on Nov. 3 for "Semiconductor device" (Japanese Inventor)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Method of fabricating semiconductor device having dummy micro bumps between stacking dies" (Taiwanese Inventors)

US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on Nov. 3 for "Manufacturing method for a die including forming a copper layer using electroless plating with zinc displacement reaction" (Chinese Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Release film and method of manufacturing semiconductor package using the same" (South Korean Inventors)